Services
Thermal Management Design
Thermal & Fluid Flow Analysis
Flow / Thermal Experiments
Finite Element Analysis
Contamination Inspection and Testing
Characterization of Semiconductor Components
Finite Element Analysis
- Ph.D. level staff with broad expertise in analysis for design and failure analysis.
- Analysis capabilities that can align with all aspects of DFSS, DfM, FMEA, and reliability calculations.
- Simulation capabilities of thermal, stress, thermal-stress, shock, vibration, drop test, fracture mechanics, and multi-physics analysis.
- Simulation tools such as ANSYS, Abaqus, LS-DYNA, Simcenter3D, and Comsol, with geometry import in all mainstream CAD and ECAD formats.
- Experience with size scales from on-chip stress in inner-layer-dielectrics (ILD) and through-silicon vias (TSVs), to package, board, and chassis levels.
- Services include:
- Package design optimization per thermal, stress, cost, weight, and reliability requirements, among others. Includes performance comparison of different materials: molding, underfill, solder alloy, laminate substrate core and buildup materials, etc.
- Failure analysis, modeling, and prediction.
- Failure modes include delamination and crack growth due to temperature cycling and/or static and transient stress.
- The simulations may be supplemented by testing performed by a network of commercial labs.
- Examples:
- SEM + EDS analysis of sectioned components
- Shadow Moiré warpage tests;
- Mechanical testing of materials and components
- Ultrasonic mapping of delamination
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Structural, stress analysis, thermo-mechanical, thermal stress/Residual Analysis
- Applications
- Structures and components
- Server rack frames
- Structure, structural joints (bolts, rivets), hinges
- Heat exchangers piping joints
- Rotary machines
- Physics and solution types
- Linear stress analysis
- Material and geometric nonlinear stress analysis
- Thermal stress
- Creep analysis
- Buckling analysis
- Hygroscopic analysis
- Fatigue analysis
Multiphysics, Thermal stress & Durability analysis
- Applications
- Chips and packages
- Solder ball at different scales
- Stress analysis due to curing – potting, epoxy, etc.
- Heating elements
- Electro-migration
- Physics and solution types
- Multiphysics electro-thermo-mechanical
- Thermal stress
- Residual stress due to the process
- CTE mismatch
- Viscoelasticity and visco-plasiticity, & creep
- Fatigue analysis
Shock and Vibration, Drop test Analysis
- Applications
- Consumer products drones, phones etc.
- Electronic modules
- Printed circuit boards
- Energy storage (battery, fuel cell) modules
- Server racks and frames
- Medical Devices
- Physics and solution types
- Resonance frequency analysis and identification
- Eigen strain analysis (preliminary design analysis) for failure site locations
- Vibration and shock analysis
- Drop test analysis
- Fatigue analysis