EXPERTS IN THERMAL MANAGEMENT
THERMAL MANAGEMENT DESIGN
AIRFLOW / THERMAL EXPERIMENTS
THERMAL & FLUID FLOW ANALYSIS
|Ever-increasing power density drives the need for high-quality and cost-effective thermal management resource. Electronic Cooling Solutions is that resource. We use state-of-the-art simulation and measurement tools and employ design and analysis methodologies that can be scaled to address emerging thermal challenges. This leads to a better thermal design. Electronic Cooling Solutions, Inc. is committed to providing thermal management expertise to the electronics industry. We strive to provide our customers with complete solutions, tailored to meet their technical requirements, so that their business goals will be achieved in a timely and cost-effective manner.|
DesignCon 2017 will be held in Santa Clara, CA on February 1-2, 2017.
The IMAPS Europe – Advanced Technology Workshop on Thermal Management will be held in La Rochelle, France on February 1-2, 2017.
SEMI-THERM 33 will be held on March 13-17, 2017 in San Jose, CA.
ITHERM 2017 will be held on May 30 – June 2, 2017 in Orlando, FL.
ASME InterPACK 2017 will be held on Augst 29 – September 01, 2017 in San Francisco, CA.